Electrode arrangement for an electronic tag
US12346760B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 8, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jul 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/0723
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A capacitive coupled radio frequency identification, RFID, tag and method for reading the tag, the tag comprising a semiconductor substrate having a first planar surface and a second planar surface distal from the first planar surface. A metallic pad formed on the first planar surface of the semiconductor substrate. A circuit formed on the semiconductor substrate and electrically connected to the metallic pad and the second planar surface of the semiconductor substrate, the circuit configured to respond to a radio frequency, RF, input signal by providing a data signal encoded by varying an impedance between the metallic pad and the second planar surface of the semiconductor substrate, wherein the metallic pad formed on the first planar surface extends beyond the semiconductor substrate. Wherein the metallic pad is rectangular, elongate or T-shaped, and/or the capacitive coupled RFID tag further comprises a metal electrode in electrical contact with the second planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.