Circuit substrate
US12347608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F3/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a circuit substrate that includes a coil component mounted on the substrate having first and second land patterns and first and second dummy land patterns. The coil component includes a first signal terminal and a first dummy terminal which are provided on the first flange part, a second signal terminal and a second dummy terminal which are provided on the second flange part, and a wire wound around the winding core part and whose one end and other end are connected respectively to the first signal terminal and the second signal terminal. The coil component is mounted on the substrate such that the first and second signal terminals are connected respectively to the first and second land patterns and that the first and second dummy patterns are connected respectively to the first and second dummy land patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.