Multilayer electronic component with a copper-containing external electrode
US12347622B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jul 21, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Dec 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an external electrode disposed on the body and connected to the internal electrodes, wherein the external electrode includes a metal including Cu, wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.