Bonded body including titanium alloy at bonding boundary
US12347744B2 · kind B2 · utility
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5References
14Claims
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Key dates
| Filing date | Dec 27, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Apr 10, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/407
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonded body includes a ceramic substrate, a copper plate, and a bonding layer provided on at least one surface of the ceramic substrate and bonding the ceramic substrate and the copper plate, in which the bonding layer contains Ag, Cu, Ti, and a first element being one or two selected from Sn and In, a Ti alloy of Ti and at least one selected from Ag, Cu, Sn, and In existing at a bonding boundary between the copper plate and the bonding layer, and the Ti alloy existing over not less than 30% per a length of 30 μm at the bonding boundary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.