Glass substrates having signal shielding for use with semiconductor packages and related methods
US12347788B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 24, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Oct 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4846
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Glass substrates having signal shielding for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer defining a channel and a through glass via (TGV). The channel at least partially surrounding the TGV. A signal transmission line is provided in the opening and extending through the core layer. An electrically conductive material positioned in the channel. The conductive material to provide electromagnetic shielding to the transmission line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.