Air-core transformer package with ferrite electro-magnetic interference (EMI) shielding of integrated-circuit (IC) chip
US12347789B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Dec 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An Integrated Circuit (IC) package has a ferrite-dielectric shield between planar transformer coils and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in transformer coils from reaching the semiconductor chip. Multiple layers of planar transformer coils serve as primary or secondary coils and can be connected together in series or parallel using center posts and coil extensions from outer coil windings to lead-frame risers that also have external package connectors such as pins or bonding balls. The center winding of an upper transformer coil connects to the semiconductor chip on a die attach pad through a center post that fits through an opening in the shield that is over the air core center of the transformer coil. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.