Method of mounting electronic component
US12347806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Sep 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.