Flexible printed circuit board assembly and electronic device including the same
US12349271B2 · kind B2 · utility
0Cited by
15References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jul 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.