Thermal conduction band for improved mobile computing device performance
US12349316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jun 14, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.