Heat dissipation module and power conversion device comprising same
US12349322B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Mar 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module comprises: a heating element; a heat dissipation member disposed on one side of the heating element and including a first plate and a second plate; a third plate disposed on one side of the heating element; and a heat transfer path for transferring the heat generated from the heating element to the heat dissipation member. The heat transfer path comprises: a first path disposed between the first plate and the second plate; a third path disposed within the third plate; and a plurality of unit heat transfer paths having a second path connecting the first path and the third path, wherein the respective second paths of the plurality of unit heat transfer paths are spaced apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.