Power conversion apparatus
US12349323B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 8, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Nov 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/07
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power conversion apparatus, comprising: a semiconductor component for power conversion; a heat transfer member to which the semiconductor component is fixed such that the heat transfer member is thermally connected to a heat dissipation surface formed on at least one surface of the semiconductor component; and a housing, wherein the housing includes a heat dissipation wall portion, a fitting portion that fits to the heat transfer member is formed on the heat dissipation wall portion at an inside of the housing space, an area of contact between the fitting portion and the heat transfer member is greater than an area of the heat dissipation surface of the semiconductor component, and an occupied area of the fitting portion as seen in plan view is smaller than an area of the at least one surface of the semiconductor component on which the heat dissipation surface is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.