Module
US12349327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Feb 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.