Connectors for high density neural interfaces
US12350501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2024 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Jun 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.