Methods for providing panel planning geometry data and laser flatbed machines for cutting out workpieces

US12350755B2 · kind B2 · utility

Assignees

• TRUMPF Werkzeugmaschinen SE + Co. KG · DE
• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Manuel Kiefer · Sinsheim, DE
• Willi Poenitz · Leonberg, DE
• Marc Teschner · Stuttgart, DE

Key dates

• Filing date: Jun 15, 2021
• Grant date: Jul 8, 2025
• Expiry date: Nov 25, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G06T2207/30164
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The disclosure provides methods for providing panel planning geometry data for planning a laser cutting process. The methods include producing an image recording of a remaining panel-shaped material, e.g., wherein the remaining panel was processed by a laser flatbed machine and has inner cutout regions, evaluating the image recording to determine a remaining panel outer contour, evaluating the image recording to determine an inner cutout region, wherein the inner cutout region is determined by an inner cutout contour identified in the image recording, deriving a remaining area of the remaining panel using the outer contour and the inner cutout region, wherein a laser cutting process can be based on the remaining area, and outputting panel planning geometry data, which define the geometry of the remaining area. Laser flatbed machines for cutting workpieces out of panel-shaped materials using a laser beam and the methods disclosed herein are also described.