Scalable fabrication of wrinkle-free and stress-free metallic and metallic oxide films
US12350903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Feb 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2551/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an embodiment, the present disclosure relates to a device having a substrate, a first polymeric layer, a second polymeric layer, a metallic layer, and a third polymeric layer. In some embodiments, the metallic layer is between the second polymeric layer and the third polymeric layer. In an additional embodiment, the present disclosure relates to a method of forming a metallic film. In some embodiments, the method includes depositing a first polymeric layer on a substrate, depositing a second polymeric layer on the first polymeric layer, depositing a metallic layer on the second polymeric layer, and depositing a third polymeric layer on the metallic layer. In some embodiments, the metallic layer is between the second polymeric layer and the third polymeric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.