Cutaway card assembly
US12350922B2 · kind B2 · utility
0Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2022 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2439/70
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plurality of workpiece layers of material are disclosed. The plurality of workpiece layers of material include a dual-sided adhesive layer assembly having a first side surface and a second side surface opposite the first side surface. The plurality of workpiece layers of material also include a first substrate layer non-removably-connected to the dual-sided adhesive layer assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.