Adhesive for bonding dissimilar materials in medical device
US12351741B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2022 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Aug 2, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2469/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.