Patent · US Active

Deposition of non-stoichiometric metal compound layer

US12351901B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

SOLERAS ADVANCED COATINGS BV · BE

Inventors

Wilmert De Bosscher · Drongen, BE
Ivan VAN DE PUTTE · Waregem, BE
Ignacio CARETTI GIANGASPRO · Ekeren, BE

Key dates

Filing date	Mar 4, 2022
Grant date	Jul 8, 2025
Priority date	—
Expiry date	Mar 4, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/332
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of depositing a layer on a piece by sputter deposition, a coater and a processor for controlling a coater in accordance with the method are provided. The method includes providing deposition of metallic and reactive species simultaneously on a piece for forming a layer under predetermined sputtering conditions, thereby providing a deposited layer on the piece comprising a metal compound. The deposited layer is subsequently irradiated and the optical transmittance is measured. A measured parameter related to the measured radiation is compared with one stored value of that parameter. The sputtering conditions are thereby adapted as a result of the comparison.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.