Heat-flow sensor
US12352637B2 · kind B2 · utility
0Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2019 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Oct 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat-flow sensor that includes an insulating layer, a magnetic field application layer arranged on a first surface of the insulating layer and composed of a conductor, and a heat-flow detection layer arranged on a second surface of the insulating layer, the second surface facing the first surface, and the heat-flow detection layer composed of a conductive magnetic body. The heat-flow detection layer faces the magnetic field application layer via the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.