Multilayer electronic component
US12354805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2022 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Apr 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes: a body including a dielectric layer and first and second internal electrode layers disposed with the dielectric layer interposed therebetween and having opposing first and second surfaces, opposing third and fourth surfaces, and opposing fifth and sixth surfaces; a first external electrode disposed on the third surface and connected to the first internal electrode layer; and a second external electrode disposed on the fourth surface and connected to the second internal electrode layer. The first internal electrode layer includes a first internal electrode, first step compensation portions disposed to be spaced apart from both ends of the first internal electrode, the third surface, and the fourth surface, and first intermediate electrodes disposed between the first internal electrode and the first step compensation portions and disposed to be spaced apart from the third surface and the fourth surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.