Multilayer electronic component
US12354808B2 · kind B2 · utility
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Key dates
| Filing date | Jun 16, 2023 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Mar 26, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a conductive metal and glass, and wherein at least a portion of the glass includes a secondary phase of the glass including barium (Ba), aluminum (Al), and silicon (Si).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.