Semiconductor device and manufacturing method thereof
US12354928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2024 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Apr 23, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first semiconductor die, a second semiconductor die and a package lid. The package lid is disposed over the first semiconductor die and the second semiconductor die. The package lid includes a roof and an island. The roof extends along a first direction and a second direction perpendicular to the first direction and includes a first portion and a second portion. The island protrudes from the first portion of the roof, wherein the island covers and is thermally connected to the first semiconductor die, and the second portion of the roof covers and is physically separated from the second semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.