Integrated device and integrated passive device comprising magnetic material
US12354948B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2022 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Nov 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/645
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device comprising a die substrate, a plurality of interconnects located over the die substrate, wherein the plurality of interconnects are configured to operate as an inductor, at least one magnetic layer that surrounds at least part of the plurality of interconnects; and at least one dielectric layer that surrounds the at least one magnetic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.