High speed data communications system for industrial use in packaged goods
US12355527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Sep 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W4/80
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for providing an electronic device includes manufacturing the electronic device at a manufacturing location, wherein manufacturing the electronic device includes connecting a wireless receiver system to the electronic device. The method further includes packaging the electronic device at a packaging location. The method further includes wirelessly transmitting data to the electronic device at a data transmission site, wherein wirelessly transmitting the data to the electronic device is performed by transferring data via near field magnetic induction utilizing a wireless transmission system, the wireless transmission system configured to magnetically connect with the wireless receiver system associated with the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.