Composites for high-frequency printed circuit boards and methods of making
US12356544B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 2, 2020 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Jul 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10−3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.