Heat shield and Josephson junction array chip system
US12356872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2024 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Nov 21, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/12
Abstract
Provided are a heat shield and a Josephson junction array chip system, the heat shield includes a cryostat, a sensor group, a radiation shield plate, a clamp assembly, and a vacuum shield cover assembly; the cryostat includes a cold head, a first-stage chassis, and a second-stage chassis; the vacuum shield cover assembly includes a first vacuum shield cover, a second vacuum shield cover, and a heat shield aluminum oxide layer; and the cold head is located in the first vacuum shield cover; and the heat shield aluminum oxide layer is coated on a surface of at least one of the first vacuum shield cover or the second vacuum shield cover; the clamp assembly on the radiation shield plate is configured to fix the Josephson junction array chip; and the sensor group adjacent to the Josephson junction array chip is arranged on the radiation shield plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.