Patent · US Active

Implant delivery devices and methods of making the same

US12357481B2 · kind B2 · utility

0Cited by
4References
21Claims
0Family size

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Key dates

Filing dateFeb 22, 2021
Grant dateJul 15, 2025
Priority date
Expiry dateJun 20, 2041

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA61F2002/9665
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

A method of assembling an apparatus for delivering an implant to a deployment site in a patient's vasculature, includes: positioning an implant engagement member at least partially within a lumen of a tubular structure, the tubular structure having a sidewall comprising a pattern of wires or struts; heating the implant engagement member; pressing at least a portion of the sidewall of the tubular structure radially inward into a surface of the implant engagement member so that the wires or the struts of the sidewall penetrate into the surface and create corresponding recesses therein; and after the recesses are created in the surface of the implant engagement member, hardening the implant engagement member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.