Wafer transfer robot apparatus based on direct drive motor
US12358734B2 · kind B2 · utility
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3References
8Claims
0Family size
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Key dates
| Filing date | Sep 6, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Nov 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer robot apparatus based on a direct drive motor, includes: a hand module including a hand loading a wafer from one surface and a hand arm coupled to the hand to transfer the wafer; an R-axis module; a connecting enclosing module having one end coupled to the R-axis module; and a T-axis module rotatably coupled to the connecting enclosure module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.