Polymer latex for dip-molding applications
US12359010B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2024 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Mar 26, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2438/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of −50° C. to 50° C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.