Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
US12359099B2 · kind B2 · utility
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1References
4Claims
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Key dates
| Filing date | Jul 29, 2020 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Jul 1, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2433/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of R1 and R2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR1 and an oxygen atom of —OR2 is 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.