Hot melt adhesive composition
US12359102B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2020 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Feb 27, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a hot melt adhesive composition having an enthalpy of crystallization below 5 J/g and comprising: a) at least 60% by weight of a composition a) comprising: —at least one copolymer A having a needle penetration higher than 15 dmm; —at least (co)polymer B having a needle penetration lower than 15 dmm; b) from 0% to 30% by weight of at least one tackifying resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.