Mold pump engagement apparatus
US12359668B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2023 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Oct 13, 2043 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D27/005
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A molten metal pump assembly and method to fill a mold with molten metal, such as aluminum. The assembly includes a support frame for suspending the molten metal pump above a furnace. The support frame includes a mechanism for lifting and lowering the molten metal pump into engagement and disengagement with the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.