Electronic devices with molded display mounting structures

US12360567B2 · kind B2 · utility

Inventors

• Daniel J. Barrett · Redwood City, US
• Dakota A. Bass · Santa Cruz, US
• Sameer Pandya · Sunnyvale, US
• Shang L. Tsuei · San Jose, US
• Elizabeth C. Porter · Sunnyvale, US
• Erik G. de Jong · San Francisco, US
• Jingjing Xu · Eden Prairie, US
• Jacquelynn M. Pok · San Jose, US
• Kiran S. Pillai · San Bruno, US
• Xuan Liu · Nanjing, CN
• Adam J. Brinkman · Sunnyvale, US
• Paul Choiniere · Livermore, US
• Daniel W. Jarvis · Sunnyvale, US
• Jia Liu · Beijing, CN

Key dates

• Filing date: Mar 27, 2024
• Grant date: Jul 15, 2025
• Expiry date: Mar 27, 2044

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/549
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.