System and method for uniform ion milling
US12362130B2 · kind B2 · utility
0Cited by
6References
28Claims
0Family size
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Key dates
| Filing date | Feb 15, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Dec 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3151
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system and method for the precise and uniform material removal or delayering of a large area of a sample is provided. The size of the milled area is controllable, ranging from sub-millimeter to multi-millimeter scale and the depth resolution is controllable on the nanometer scale. A controlled singularly charged ion beam is scanned across the sample surface in such a manner to normalize the ion density distribution from the sample center toward the periphery to realize uniform delayering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.