Electrostatic chuck and semiconductor processing apparatus
US12362217B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2023 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Aug 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6831
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck arranged in a process chamber of a semiconductor processing apparatus includes an insulation layer for carrying a wafer and an electrode assembly arranged in the insulation layer. The electrode assembly is electrically connected to a direct current (DC) power supply and a radio frequency (RF) power supply. When the DC power supply applies DC power to the electrode assembly, the electrode assembly is used to adsorb the wafer on the insulation layer. When the RF power supply applies RF power to the electrode assembly, the RF power is uniformly distributed to different positions of the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.