Integrated circuit (IC) and electronic apparatus
US12362265B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Jan 20, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0665
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) is provided. The IC includes a molding compound, a plurality of pins, an exposed pad, a die surrounded by the molding compound, an adhesive material, and a plurality of bonding wires. The pins are disposed on at least one edge of the molding compound and separated from each other. The adhesive material is disposed between the die and the exposed pad and surrounded by the molding compound. The exposed pad is electrically connected to the die through one of the bonding wires, and the pins are electrically connected to the die through the remaining bonding wires. The die is configured to detect whether a chassis intrusion event is present in response to a signal from the exposed pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.