Electronic package and method for manufacturing an electronic package
US12362267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2021 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Oct 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.