Conductive structures and methods of fabrication thereof
US12362273B2 · kind B2 · utility
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10References
20Claims
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Key dates
| Filing date | May 17, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Sep 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53223
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure relate to methods of fabricating conductive features to prevent metal extrusion. Particularly, the conductive feature includes a control layer to reduce grain size of a metal containing layer, thus obtaining a robust structure to decrease extrusion defects. In some embodiments, the control layer is formed between a barrier layer and the conductive feature. In some embodiments, the control layer is formed by adding a control element, such as oxygen, to an upper portion of the barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.