Semiconductor device
US12362339B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 10, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Aug 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/716
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor device c includes: a package substrate including a base including a mount portion, and terminals; a semiconductor chip including a first pad to which a ground voltage is supplied, a second pad electrically connected to a first terminal among the terminals, and a semiconductor circuit connected to the first and second pads, the semiconductor chip being provided above the mount portion; and a first capacitor chip including a first capacitor unit provided in a silicon substrate, a first node supplied with the ground voltage, and a second node electrically connected to the second pad, the first capacitor chip being provided above the mount portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.