System and method for cooling switching devices in an integrated motor drive
US12362634B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | May 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Power semiconductor switching devices in an integrated motor drive are mounted directly to a circuit board substrate via a “pick and place” assembly process. The circuit board substrate is then mounted within the housing for the integrated motor drive and, preferably, in a generally central orientation within the housing. A potting material is provided within the housing of the integrated motor drive and around the circuit board. The potting material substantially encloses the circuit board and fills the volume within the integrated motor drive. The potting material is selected to provide good thermal conductivity between the circuit board and the housing of the integrated motor drive. The potting material is also selected to provide flexibility such that expansion and contraction of the potting material due to heating and cooling of the material does not damage the circuit board or the electronic components mounted to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.