Electronic device housing having a radio-frequency transmissive component
US12362777B2 · kind B2 · utility
0Cited by
76References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2023 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Sep 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/44
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.