Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation
US12364026B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 10, 2020 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Jun 26, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a barrier-type photovoltaic solder strip capable of reducing damp-heat (DH) attenuation, the photovoltaic solder strip comprising a photovoltaic solder strip body. A moisture barrier layer is arranged on a surface of the photovoltaic solder strip body that is not in contact with an electrode of a solar cell, and the moisture barrier layer can prevent external water and gas from entering the photovoltaic solder strip body, thus, on the basis of low cost, corrosion of the photovoltaic solder strip body by acidic substances, oxidizing agents and water in a module is reduced, thereby reducing attenuation of a photovoltaic module in a DH environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.