Patent · US Active

Method and device for providing through-openings in a substrate and a substrate produced in said manner

US12365051B2 · kind B2 · utility

0Cited by

3References

21Claims

0Family size

Assignee

LPKF LASER & ELECTRONICS SE · DE

Inventors

Robin Alexander Krueger · Hannover, DE
Norbert Ambrosius · Kevelaer, DE
Roman Ostholt · Langenhagen, DE

Key dates

Filing date	Feb 28, 2023
Grant date	Jul 22, 2025
Priority date	—
Expiry date	Jul 16, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/49827
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A substrate comprises glass, sapphire, silicon and/or aluminosilicate, and has at least one recess or through-opening. The at least one recess or through-opening is formed by anisotropic removal of substrate material by etching a portion of the substrate that has been modified by a pulse of laser radiation in a direction of a thickness of the substrate. The modified portion of the substrate extends along a beam axis of the laser radiation. The pulse of laser radiation was applied with a focus extending from a first focal depth positioned past one side of the substrate to a second focal depth located at an opposite side of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.