Distributed MEMS switch array design with multiple input/output ports
US12365579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2022 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Oct 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0084
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micro-relay switch array may comprise an array of micro-relays disposed on a substrate, and a cap disposed over the array of micro-relays, thereby encapsulating the array of micro-relays. The micro-relay switch array may further comprise an array of through-substrate vias (TSVs) associated with the array of micro-relays, arranged such that columns of TSVs alternate with columns of micro-relays, and a plurality of device electrical conductors, each of which electrically couples one of the TSVs of the array of TSVs directly to at least two of the micro-relays. The micro-relay switch array may further comprise a plurality of TSV electrical conductors, each of which electrically couples at least two TSVs together. Each micro-relay of the array of micro-relays may be a micro-electromechanical system (MEMS) switch. The substrate and cap may be glass, and the TSVs may be through-glass vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.