Resin composition
US12365797B2 · kind B2 · utility
0Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2020 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Jun 20, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resin composition, a method for manufacturing the same and a use thereof are provided. The resin composition provides excellent thixotropy while having one or more excellent properties selected from thermal conductivity, adhesiveness, insulation properties, tensile characteristics, hardness and flame retardancy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.