Optical assembly for parallelism measurement, optical apparatus including the same, die bonding system and die bonding method using the same
US12366444B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2023 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Feb 5, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/286
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.