Photonic integrated circuit
US12366708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2022 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/132
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device includes a substrate, a dielectric layer on the substrate, a waveguide within the dielectric layer, and a photodetector optically coupled to the waveguide. The photodetector is disposed above the waveguide layer and is monolithically integrated with the substrate. The photodetector is configured to operate at low temperatures, such as below about 50 K or about 20 K. In some embodiments, the monolithic photonic device includes thermal isolation structures and optical isolation structures. Techniques for manufacturing the monolithic photonic device, including the thermal isolation structures and optical isolation structures, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.