Device bonding apparatus and method of manufacturing a package using the apparatus
US12368128B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2022 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Nov 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/808
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and a second bond head configured to press the die against the wafer, the second bond head including a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the second thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.