Driving backplane, transfer method for light-emitting diode chip, display apparatus
US12368144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2021 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Sep 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A driving backplane, a transfer method for a light-emitting diode chip (21), and a display apparatus. The driving backplane comprises: a base substrate (10), a driving circuit, a plurality of electromagnetic structures (13), and a plurality of contact electrodes (12). The plurality of electromagnetic structures (13) in the driving backplane are symmetrically arranged relative to a first straight line (L1) and a second straight line (L2). A current signal can be applied to each electromagnetic structure (13) by means of the driving circuit. Stress generated by a transfer carrier plate (20) according to the magnetic force of each electromagnetic structure (13) moves the transfer carrier plate (20). When the transfer carrier plate (20) is stress balanced in each direction parallel to the surface of the transfer carrier plate (20), the light-emitting diode chip (21) is precisely aligned to corresponding contact electrodes (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.