Electronic device
US12368795B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2021 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20445
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments of this application provide an electronic device, in which a heat sink in the electronic device is multiplexed as a heat dissipation component and a radiator of an antenna. The heat sink provided by the embodiments of this application can be used as a heat dissipation component to distribute heat evenly, such as to cool down an overheated electronic element. In addition, the heat sink can be used as a radiator of an antenna to form an antenna unit with a feed unit and generate radiation to the outside. The heat sink in a first region can be used as a main radiator of the antenna unit to meet the demand for the number of antennas in a 5G wireless communication system, and can also be applied to other communication systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.